HBM THERMOCOMPRESSION BONDING
HBM thermocompression bonding equipment
HBM thermocompression bonding equipment
Named Dual TC Bonder family
AI & HPC · Data Center
Public source
Dual TC Bonder is a publicly named HANMI Semiconductor HBM equipment family.
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Illustrative representation based on publicly available technical information.
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
Official HANMI product pages present Dual TC Bonder tools (Dragon, Griffin, Tiger and related) for thermocompression stacking of HBM. This listing records the Dual TC Bonder platform rather than every bonder variant. Throughput claims should be taken from HANMI’s current product pages.
Key characteristics associated with this technology.
HBM thermocompression bonding equipment
Named Dual TC Bonder family
Die-stack assembly rather than wafer etch
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