Skip to content
Silicon Showcase
CompaniesApplicationsTechnology AreasAbout
Submit Technology
Submit Technology
Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas
  • About Us
  • How It Works
  • Submit Technology
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Disclaimer

Explore

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas

About

  • About Us
  • How It Works
  • Submit Technology
  • Contact Us

Legal

  • Privacy Policy
  • Terms of Use
  • Disclaimer

© 2026 Silicon Showcase™. All rights reserved.

Explore. Compare. Innovate.

Silicon Showcase
CompaniesApplicationsTechnology AreasAbout
Submit Technology
Submit Technology
Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas
  • About Us
  • How It Works
  • Submit Technology
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Disclaimer

Explore

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas

About

  • About Us
  • How It Works
  • Submit Technology
  • Contact Us

Legal

  • Privacy Policy
  • Terms of Use
  • Disclaimer

© 2026 Silicon Showcase™. All rights reserved.

Explore. Compare. Innovate.

  1. Home
  2. /Technologies
  3. /III-V Foundry Process Platform

GAAS AND GAN

GaAs and GaN foundry processes

COMPOUND-SEMICONDUCTOR FOUNDRY RATHER

Compound-semiconductor foundry rather than a catalog MMIC

APPLICATIONS

Data Center · Telecommunications · Aerospace & Defense

Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.

GAAS AND GAN

GaAs and GaN foundry processes

COMPOUND-SEMICONDUCTOR FOUNDRY RATHER

Compound-semiconductor foundry rather than a catalog MMIC

APPLICATIONS

Data Center · Telecommunications · Aerospace & Defense

Public source

III-V Foundry Process Platform

Foundry / Process

III-V Foundry Process Platform is a publicly named MACOM MESC foundry offering covering GaAs pHEMT/mHEMT and GaN-on-Si HEMT processes.

  • Data Center
  • Telecommunications
  • +1
United StatesView Official Source (opens in a new tab)

Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.

Overview

MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.

Official MACOM process pages describe device processes for LNA, PA and T/R chips from microwave through mmWave. The listing is parked in Photonics because Foundry / Process does not yet exist; it is not dumped into Design & IP. This listing records the III-V foundry platform rather than MACOM’s catalog MMICs.

Capabilities

Key characteristics associated with this technology.

  • GaAs and GaN foundry processes

  • Compound-semiconductor foundry rather than a catalog MMIC

  • Parked in Photonics pending a Foundry / Process area

Organization

MACOM Technology Solutions

United States

View organization

Official resources

  • MACOM MESC processesmacom.com (opens in a new tab)

Source & disclosure

Independent discovery listing. This profile was prepared from publicly available information published by the organization. For the latest and complete technical information, refer to the official company source.

Official source

macom.com (opens in a new tab)

Last source check

Sep 15, 2026

Notice something that needs updating?

Report a correction

Related Technologies

Explore other semiconductor technologies.

Connectivity & RF

Koala NB-IoT SoC

NB-IoT system-on-chip that WiSig Networks describes as a 3GPP-compliant device with satellite non-terrestrial-network support and edge AI.

TelecommunicationsIoTView Technology
Connectivity & RF

Pruthvi-3 SDR Chipset Series

Saankhya Labs' Pruthvi-3 is a software-defined radio chipset series spanning baseband, mobile-receiver and modulator devices.

TelecommunicationsIoTView Technology
Connectivity & RF

Vihaan-I Networking SoC

Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.

AutomotiveIndustrialView Technology
Advanced Packaging

APTURA Thermo-Compression Bonding

Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.

AI & HPCData CenterView Technology