COHERENT CHIP-TO-CHIP /
Coherent chip-to-chip / package-level interconnect
Coherent chip-to-chip / package-level interconnect
Processor and accelerator connectivity in multi-die systems
AI & HPC · Data Center
Public source
NVIDIA NVLink-C2C is a publicly named high-bandwidth coherent chip-to-chip interconnect for connecting processors, accelerators and custom silicon.
Official technology image
NVIDIA NVLink-C2C is a high-bandwidth coherent chip-to-chip interconnect for processors, accelerators and custom silicon inside a package. Distinct from NVLink GPU-to-GPU fabric.
Official NVIDIA pages describe NVLink-C2C as an interconnect used in chiplet and advanced multi-die systems, including integration in advanced packages. It is a package-level die-to-die link, not the GPU-to-GPU scale-up fabric. NVIDIA NVLink, listed separately, is the system-level GPU interconnect used within servers and across racks with NVLink Switch. Signaling rates, protocol details and product-generation mappings should be confirmed on NVIDIA's current NVLink-C2C documentation.
Key characteristics associated with this technology.
Coherent chip-to-chip / package-level interconnect
Processor and accelerator connectivity in multi-die systems
Advanced package integration
Distinct from NVLink GPU-to-GPU scale-up fabric, which is listed separately
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