HIGH-DENSITY FAN-OUT WAFER-LEVEL
High-density fan-out wafer-level packaging
High-density fan-out wafer-level packaging
Named SWIFT platform
AI & HPC · Data Center · Consumer Electronics · +1
Public source
SWIFT High-Density Fan-Out is a publicly named Amkor Technology packaging platform.
Silicon Showcase illustrative visual
Illustrative representation based on publicly available technical information.
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
Official Amkor pages present SWIFT as a high-density fan-out wafer-level package family. This listing records the SWIFT platform rather than every Amkor package type. Design rules should be confirmed on Amkor’s current SWIFT pages.
Key characteristics associated with this technology.
High-density fan-out wafer-level packaging
Named SWIFT platform
OSAT packaging rather than a foundry process
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