300 MM CHEMICAL-MECHANICAL
300 mm chemical-mechanical polishing equipment
300 mm chemical-mechanical polishing equipment
Dual polishing heads, multi-zone heads and modular cleaning
Automotive · AI & HPC · Industrial · +1
Public source
Universal-H300 is the 12-inch CMP equipment Hwatsing publishes for leading-edge planarization.
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Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
The official product page describes one platen with two polishing heads, eight-zone polishing heads, endpoint detection and modular horizontal cleaning, for integrated circuits, advanced packaging and large silicon wafers. This listing records Universal-H300.
Key characteristics associated with this technology.
300 mm chemical-mechanical polishing equipment
Dual polishing heads, multi-zone heads and modular cleaning
Published for integrated circuits, advanced packaging and silicon wafers
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