HETEROGENEOUS-INTEGRATION PACKAGING PLATFORM
Heterogeneous-integration packaging platform
Heterogeneous-integration packaging platform
Fan-out and 2.5D constructions in one named family
AI & HPC · Data Center · Consumer Electronics · +1
Public source
VIPack is a publicly named ASE Technology Holding advanced-packaging platform.
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Illustrative representation based on publicly available technical information.
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
Official ASE VIPack pages present the family as a heterogeneous-integration offering spanning fan-out, 2.5D and related constructions. Automated fetches of the page may return 403; the URL remains ASE’s official VIPack path. This listing records the VIPack platform rather than every ASE package type. Construction options should be confirmed on ASE’s current VIPack pages.
Key characteristics associated with this technology.
Heterogeneous-integration packaging platform
Fan-out and 2.5D constructions in one named family
OSAT platform rather than a foundry process
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