OVERLAY MEASUREMENT OF
Overlay measurement of layer-to-layer alignment on product wafers
Overlay measurement of layer-to-layer alignment on product wafers
Dimensional and critical-dimension metrology for pattern geometry
Automotive · Data Center · Consumer Electronics
Public source
KLA publishes metrology systems that measure pattern dimensions, film thickness, layer-to-layer overlay, pattern placement and related geometry for chip manufacturing.
Official technology image
KLA overlay and dimensional metrology systems measure layer-to-layer alignment, critical dimensions and related pattern geometry. Distinct from defect inspection and review.
Official metrology pages describe imaging-based and scatterometry-based overlay tools and dimensional-shape measurement used for process characterization and high-volume monitoring, including EUV patterning control. Named tool series such as Archer, ATL and SpectraShape remain capabilities of this measurement family rather than separate listings. This listing is metrology by measurement, not defect inspection and review, which is listed independently. Sensitivity, sampling and tool-model details should be taken from KLA’s current metrology documentation.
Key characteristics associated with this technology.
Overlay measurement of layer-to-layer alignment on product wafers
Dimensional and critical-dimension metrology for pattern geometry
Named overlay and CD tool series as family capabilities, not separate listings
Distinct from defect inspection and review, which is listed separately
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